University of Delaware - College of Engineering
ELECTRICAL & COMPUTER ENGINEERING

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Nanofabrication Facility

Capabilities & Equipment

Etching

PlasmaTherm 790 RIE

Fluorine RIE System

  • PlasmaTherm 790 RIE
    • Reacitve-ion etching tool employing capacitively-coupled plasma.  It is capable of etching Si and other materials with a high aspect ratio, using the Bosch process.

Fluorine ICP System

Samco 200 RIE-iP
  • Samco 200 RIE-iP
    • inductively coupled plasma etching system equipped with fluorine-based gasses for dry etching of silicon and germanium

Chlorine ICP System

  • Samco 200 RIE-iP
    • inductively coupled plasma etching systems one equipped with chlorine-based gasses for dry etching of III-V compound semiconductor materials and metals

Capabilities & Equipment


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